Micron Technology Inc

23 open interview-eligible roles at Micron Technology Inc. Click any role to see locations and prep pointers.

• DRAM Architect - Principal Engineer | MTS - TPG
• DRAM Dry Etch Principal Engineering Lead
• DRAM Memory Design Engineer - Principal | MTS | SMTS
• HBM SIPI, Staff Engineer
• Principal Customer Integration Engineer, Product & Process Engineering (HBM)
• Principal Design Engineer, DRAM
• Principal Diffusion Process Development Engineer, DRAM
• Principal Engineer Advanced DRAM PI
• Principal Engineer Photolithography DRAM Process Development (Evergreen)
• Principal Memory Design Engineer, HBM
• Principal Process Engineer, Die Bonding
• Senior Member of Technical Staff, Advanced DRAM Overlay Engineer
• Staff Design Engineer, DRAM
• Staff Design Engineer, HBM Architecture
• Staff Digital Design Engineer, HBM
• Staff DRAM Design Engineer
• Staff Engineer, Adv DRAM PI
• STAFF ENGINEER, DRY ETCH DRAM
• STAFF ENGINEER, PHOTO DRAM
• Staff Physical Design Engineer, HBM
• Staff Process Engineer, APTD Bonding
• Staff SoC DFT Engineer, HBM
• Staff Verification Design Engineer, DRAM